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GNAD/P L&P Machine


The GNAD/P range is the advanced generation of precision lapping and polishing machines offering the significant refinement and benefit for material processing application,including Si, SiC, GaN, InP, GaAs, CZT and MCT etc.
Constructed by aluminium and rigid polyurethane to fully withstand the most rigorous polishing environment, it is suitable for both lapping and chemical polishing process.
All functions can be controlled by an independent removable control system. According to the specific requirements of the process, the removable control system can choose the WIFI /blue tooth or wired mode to control the machine.
● Independent Remote Control System
● Multi-Machine Control via One Control  System
● Auto Temperature & cooling Control
● Multi-Feeding System
● Auto-Clean Control System
SH range precision polishing Jigs are used for holding the samples of widely varied shape while they are lapped and/or polished on GNAD machines. The jig with a dial gauge can indicate stock removal, the accuracy data is 1 micron.
The jig auto-rotation control system can drive and control jigs rotation speed from 0-120rpm. The sweep range is controlled from 0-100%, this function can reduce the polishing time to improve remove rate and final roughness and flatness.
Basic operation of the lapping/polishing plate is controlled from the Main Drive section. From here the plate speed is set and displayed on an LCD. This is infinitely variable from 0 to 120 rpm to make sure suitable speed for the process to be selected.
The automatic plate flatness control system continually monitors the plate shape and automatically corrects any deviations from the required shape set by the operator.
The auto-clean control system will automatically clean the plate and removable drip tray, the time and feed will be controlled. The timer on the Main Drive panel can be set to run the machine for up to 10 hours. Constant supervision by the operator is unnecessary. It will give operator more freedom as processing will stop automatically after the chosen time or thickness.

Technical data

Power Supply:  250V、10A  / 110V、10A   
Wafer Capacity: 6”/152mm x 1、6”/152mm x 2、6”/152mm x 3
Plate diameter: 300mm、350mm、420mm
Plate speed: 0-120rpm
Jig rotation speed:  0-120rpm 
Jig Sweep Frequency: 0-30spm 
Work Time:  0-10 hours 
Abrasive delivery: 1/2/3/4/5/6 feeding channels