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CM/005-MF Plasma Cleaner



Plasma including atoms, molecules, ions, electrons, reactive, excited atoms, molecules and radicals activation, the particles of energy and activity is high, the energy enough to destroy almost all of the chemical bonds in any exposed surface caused by chemical reaction, thus some chemical bonds was opened after combination of oxygen on highly active substances, make the material surface hydrophilicity is increased greatly, at the same time on the material on the surface of the oil and other organic macromolecule new chemical reaction, generate gaseous molecules, such as carbon dioxide, gaseous substances such as water vapour is vacuum pump away, so as to achieve the molecular level of material surface cleaning.Bonding /bonding/ printing/coating/packaging and other processes can make the products more reliable and better yield.
  Product Feature:
1.Modular design,Compact Structure, Easy to install on the assembly line
2.Excellent high speed processing effec
3.Conventional treatment requires only compressed air and has a very low cost of use
4.At lower temperature, there is no thermal damage and thermal oxidation
5.Under normal processing speed substrate temperature not to exceed 45 ℃
6.Ozone emissions are minimal, less than 0.001PPM